Die Attach/Wire Bond Process Development Senior/Staff Engineer

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.
Responsibilities:Coordinates and supervises all Die attach & Wire Bond project activities and operations in assembly process/integration phase of R&D projects.
Leads a team of Process Development Engineers and Support Technicians to execute & monitor Die attach & Wire Bond activities from process development to product realization, subsequently leading to successful mass volume production.
Plans and administers work, ensuring maximum productivity and cost efficiency from development to product realization.
Minimum Requirements:Bachelor's Degree in Electrical, Electronics, Mechanical Engineering, Chemical or equivalent.
Preferred experience in HVM environment for IC or LED manufacturing.
3-5 years of experience in HVM in IC/LED/Semiconductor R&D environment, especially in Die Attach & Wire Bond process scope.
Technical knowledge in semiconductor or LED backend assembly processes.
6 Sigma Methodology, Green/Black Belt is an advantage.
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