Resident Senior Engineer (Fol Process - Flip Chip, Die Attached) - Based In Ipoh

Resident Senior Engineer (FOL Process - Flip Chip, Die Attached) - Based in IpohOur client is a leading semiconductor company specializing in high-performance power solutions.
Job Location:Ipoh
Job Responsibilities:
Address assembly quality issues, identify root causes, and implement effective corrective actions to prevent recurrence.
Perform regular audits and quarterly performance evaluations, discussing quality and technical issues with suppliers to support continuous improvement and product reliability.
Monitor and analyze weekly assembly yield, defect modes, and SPC to maintain quality system capability, and check daily assembly WIP to ensure short cycle times and timely delivery.
Conduct risk assessments and manage wafer incoming issues at suppliers, as well as assembly issues on the test floor.
Generate and assess supplier quality reports, establish baselines, and identify opportunities for continuous improvement.
Collaborate with FA engineers to identify assembly failures, determine root causes, and implement corrective actions with assemblers.
Coordinate the qualification of new suppliers, materials, packages, and assembly processes.
Job Requirements:
Bachelor's degree in Engineering or a related field.
Experienced inWafer saw, Die attach/Flip chip bond, Wire bonding, Moldingare preferred.
Familiarity with general assembly processes and QA controls (8D CAR, FMEA, SPC, etc.).
Understanding of basic FA and reliability concepts.
Proficiency in English, both written and spoken.#J-18808-Ljbffr