Job Description Maximize COP process capability to handle wide range of product portfolio.
Drive for COP process yield improvement and monitoring.
Drive for COP related test QDN investigation and improvement plan.
Drive COP improvement projects.
New product recipe development and low volume manufacturing validation before enter into mass volume phase.
Liaise and work with equipment team on equipment related improvement and new machine qualification.
Project management in project related to COP yield improvement, cost saving and process efficiency.
Qualifications Bachelor's Degree and above in an engineering discipline (electrical, mechanical, electronics, chemical & material ) Minimum 3-5 years of working experience in semiconductor IC packaging, preferable in finishing process.
Good communication and presentation skill.
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