JOB RESPONSIBILITIES: Establish the test capability and the capacity/productivity model.
Able to fully define and characterize the designated process Define the PCP and improving critical test capability (as defined in the process control plan, product drawings/ specification and BOM) Fully understand the necessary controls, equipment, precautions, setup parameters to meet the product and test specifications.
Apply lean manufacturing principles to eliminate waste in the production process and implement yield improvement projects.
Responsible for the test yields of the designated process.
Responsible to establish and implement all appropriate actions to improve the yields.
Responsible to conduct gage repeatability & reliability studies, correlation studies as well as actions to improve both these capabilities.
Generate reaction plans for OOC situations Assist the manufacturing personnel in operator training, qualification and improving operator utilization and productivity as well as inventory reduction Communication skill to communicate and interface well with peers, enhance teamwork Emotional intelligence Derive Continual Improvement and use of resources Performing any other duties as directed by the immediate superior from time to time.
Practice Risk Base Thinking in planning and execution of task.
Compliance to ISO Requirements, company rules & regulations, applicable codes etc.
JOB REQUIREMENTS Minimum: Masters/bachelors degree in electrical/Electronics/Materials/Mechanical Engineering.
Minimum 5years of working experience in wire bond process, preferably in the area of high speed devices >1GHz.
Experience in MNC manufacturing environment, preferably in metal can/TO can manufacturing line.
Solid DOE and SPC experience.
Good knowledge of FOL/semiconductor processes.
Very good communication skills and ability to work effectively in a cross functional environment with people at all levels.