Advanced Packaging Flagship Curriculum Internship Program

Advanced Packaging Flagship Curriculum Internship ProgramJob Details:
Job Description:
Responsibilities and scopes may be quite diverse depending on the function or project assigned.
The industrial exposure and technical skills learned will enhance the student's knowledge and experience for their future career undertaking.
Qualifications:
This internship is only open for undergraduate students who have taken the Advanced Packaging Flagship Curriculum and are required to undergo the internship program by USM academic plan.
Job Type:Student / Intern
Shift:Shift 1 (Malaysia)
Primary Location:Malaysia, Kulim
Business Group:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world-class Supply Chain and facilities support.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Work Model for this Role:
This role will require an on-site presence.
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Perks and Benefits:
Medical, Miscellaneous allowance, Education support, Dental, Sports (e.g.
Gym), Parking, Vision meal subsidy, daily free fruits, mother's room.#J-18808-Ljbffr