Advanced Packaging Internship

Details of the offer

This program offers a unique internship opportunity specifically designed for students enrolled in the Advanced Packaging Flagship Curriculum.
You'll gain practical experience in Intel's cutting-edge facilities, applying the knowledge you've acquired in the program to real-world scenarios within the field of advanced packaging technologies.
Qualifications
Currently enrolled in a program participating in the Advanced Packaging Flagship Curriculum.
Completion of coursework related to advanced packaging technologies.
Eagerness to learn and apply knowledge in a fast-paced environment
Ability to follow safety protocols and work effectively in a team setting
Responsibilities
Responsibilities and project assignments will vary depending on the specific function or department you're assigned to.
The internship focuses on providing practical exposure to advanced packaging processes and their role within the semiconductor manufacturing ecosystem.
Tasks may involve assisting engineers with projects, participating in data collection and analysis, and contributing to process improvement initiatives.
Gain valuable hands-on experience in advanced packaging, a critical technology in the semiconductor industry
Apply classroom knowledge to real-world applications under the guidance of experienced professionals
Develop practical skills and enhance your understanding of the advanced packaging landscape
Strengthen your resume and gain a competitive edge for future career opportunities in the field#J-18808-Ljbffr


Nominal Salary: To be agreed

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