Assistant Engineer Failure Analysis

In your new role you will:Prepare specimens for optical, cross-section and Scanning Electron Microscope [SEM] examination (XSEM job).Use the Scanning Electron Microscope [SEM] to collect images and make measurements (IFKM & IFX Construction Analysis job).Perform cross-section analysis using mechanical polishing, FIB, Laser preparation, Ion Miller and etc.Must be willing to work on 12hours rotating shift.Carry out routine chemical analysis and other analysis.Perform TEM lamella preparation.Compliance lab instruction, VA and APA.Effective pass down to next shift personnel.Adhere to Environmental, Safety and ESD compliance regulations.Ability to interface effectively with employees and laboratory customers.Work closely with peers and supervisor in undertaking the respective taskAccurate data measurement.Safe chemical handling.Semiconductor processing, fabrication and testing.FoK Imaging, optical and SEM.You are best equipped for this task if you have:Diploma Electrical Engineering, Chemistry, Material Science or any science discipline>5 years of experience in semiconductor or failure analysis field.Failure Analysis Field of Knowledge: Sample preparation, mechanical polishing, precision cleaving and wet chemical.BenefitsCoaching, mentoring networking possibilitiesWide range of training offers & planning of career developmentInternational assignmentsDifferent career paths: Project Management, Technical Ladder, Management & Individual ContributorFlexible working conditionsHoliday child careMedical coverageOn-site social counselling and works doctorHealth promotion programsOn-site gym, jogging paths, beachvolleyball, tennis & soccer courtOn-site canteenPrivate insurance offersFlexible transition into retirement