Job DescriptionESSENTIAL DUTIES AND RESPONSIBILITIES:
In this position, the individual will be responsible for fully supporting the Department Manager on the development of the company goals, strategy, and tactics. The most important expectation is being able to work with the other team to assure the good execution of daily activities and special assignments assigned by department managers or higher management.The individual will be responsible to lead the process engineering functions for DA process. He/she is required to work closely with the teams within Assembly Process Engineering department as well as other functional teams; manufacturing, EE, IPPC, QA, NPI, and other supporting teams to fully support the company and department goals on yield, quality, and cost, utilization, productivity and cycle time.Good knowledge Die Attach process with hands-on experience.Qualifications
To be qualified for this position, the individual shall come with the following skills:Able to lead a group of process engineers and technician.Be a mentor and coach for the engineers and technicians, providing the technical support whenever necessary.Good in problem-solving skills by applying the standard solving methodology, DMAIC, 8D, etc.Good working knowledge in MSA, SPC, and DOE.Document SOP, WI, FMEA, FMEA+, OCAP, and Control Plan for related process.Ensure effective handshaking process of new device/product introduction to the line and new process technology capabilities developments.Responsible for new material/component first articles inspection and final buyoff.Continuous improvement on direct/indirect material cost down & yield enhancement program.Ensure robustness of process control to meet yield & throughput expectation.Report any non-conformance/customer complaints issue and develop/follow up the improvement actions.Lead or work together with other sites of WD for project transfer or sharing of improvement projects.Fully participate to resolve the issue through teamwork and be the main coordinator for any internal/external audit programs.REQUIRED:
Master or Bachelor degree in Mechanical/Material/Electrical/Electronic Engineering or Physics.5+ years of process engineering experience in semiconductor assembly on engineering for equipment maintenance/repair/improve in DA.Accept flexible working time if needed.SKILLS:
Knowledge on DA and Die Sort process, familiar with RENESAS DIE BONDER machine and C-SUN/UTIC/APT.Experience in handling the high die stack DA, 1D until 16D with very thin die capability.Involved in yield improvement activities using statistical tools and drive yield meeting with internal and external team. Lean Six Sigma Knowledge is preferable.Basic understanding of package level testing & reliability. Proficient in standard business application software, Tools & standard engineering methods (Word, Excel, PowerPoint, AutoCAD, JMP, SPC, DOE, DMAIC, 8D, 5-why, etc.).A proven desire to work as a team member, both on the same team and outside of the team.Ability to troubleshoot and analyze complex problems. Ability to multi-task and meet deadlines.Excellent English communication (written and verbal) and interpersonal skills.#J-18808-Ljbffr