DMW License No: POEA-080-LB-032818-R
Accreditation No: 10413737101525
Job Description:
1.
Responsible for Die Prep/ Die Attach process and equipment as demonstrated by the yield, quality, reliability performance of all customer products.
2.
Drive equipment capability, upgrading/modernization, sustainability, equipment efficiency & stability.
3.
Knowledge and exposure in wafer back grind, dicing, AOI, die attach, hands-on in Disco/ Okamoto/ASM/ ESEC equipment and troubleshooting is a must.
4.
Drive, establish and implement process simplification/optimization programs/process & equipment automation projects to improve yield, quality, lead time & cost.
5.
Drive cost saving projects through improve & qualify new cost-effective factory supplies and indirect material, factory supplies usage/wastage of reduction to meet Finance cost/sale target.
6.
Manage spare parts for equipment and repair of damaged parts.
7.
In charge of customer accounts to provide solutions on technical difficulties/new technologies challenges, business review, calibrate new products & technology roadmap.
8.
Lead in knowledge GURU programs, to up-skill workforce productivity & agility.
Qualification:
A minimum of 5 year(s) of working experience is required.
Candidates must be a Bachelor's / College Degree holder in Engineering (Electrical/Electronic) or similar fields.
Must possess strong knowledge in Die-Attach process involving multi-die stack technology (up to 16 die-stack) in memory product manufacturing.
Practical experiences with all the equipment in die prep process and maintenance.
Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, preventive maintenance.
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