Die Bond Technical Expert

About the roleThe Diebond Technical Expert is responsible for driving the diebond strategy in Nexperia BEWhat you will doTo assure that Nexperia has the right capabilities, aligned with package R&D roadmapTo continuously drive improvements in capability and throughput together with the sites.To create synergies between Nexperia's BE sites and make sure best practices are shared acrossTo define the appropriate tooling design rules for the diebond areaWhat you will needDegree holder in Engineering related disciplines.
Preferably Mechanical, Mechatronic or Electrical engineering.At least five (5) years of related working experiences in semiconductor manufacturing environmentSkillful on Die bond assembly processes.
Experience with the main Diebond models in Semiconductor BEFamiliar with Six-sigma techniques, FMEA, DOE and statistics.Statistical analysis & quality and problem-solving tools.
E.g.
DOE, SPC, FMEA, 8D and Minitab etc.Able to work in international work environment with ability to influence people through data.Requires travel to Nexperia factories, partners and exhibitions.Talent acquisition based on Nexperia vacancies is not appreciated.
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