Job Description In your new role you will: Perform full physical failure analysis on Memory, IoT, USB and Microcontroller, and write failure analysis report.
Liaise with relevant engineering groups on analysis and corrective actions.
Spearhead development of new analysis techniques to meet technology and device challenges.
Take ownership of certain tools and equipment.
Your Profile You are best equipped for this task if you have: Bachelor in Electronics/Electrical/Microelectronics/Material Engineering, Material Science, Physics or Chemistry.
Minimum 1-2 years' experience in silicon level failure analysis on IC failure.
Fresh graduates are encouraged to apply for this position.
Preferable with knowledge related to semiconductor and physics.
Familiarity in die deprocessing and proficiency in operating advance failure analysis tools e.g.
FESEM and FIB would be added advantage.
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