Engr Sr Prin, Package Development

To perform Package Development for BGA related packages. Participate and lead in new package / platform development. Perform package integrity analysis using appropriate tools. Maintain product quality while developing and introducing package cost reduction programs. Timely develop/introduce new products with competitive cost/differentiation Qualifications QUALIFICATION AND EXPERIENCE Bachelor/Master/PhD Degree in Engineering Experience in BGA with CMOS related packaging/process development ispreferred KNOWLEDGE, SKILLS AND ABILITIES Experience/knowledge in the packaging technology including substrate, bump and BGA assembly process experience in package design and manufacturing review. Proven experience utilizing statistical analysis techniques such as JUMP, DOE Able to postulate potential cause of problem & identify simulation totest the hypothesis. About Us onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.


More details about our company benefits can be found here: We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. Job Info Job Identification 2500740 Job Category Engineering Posting Date 04/21/2024, 11:28 PM Degree Level Bachelors Job Schedule Full time #J-18808-Ljbffr