Ic Package Design Engineer

Please enter a job title/role/skill to search
Your recent searches
Top Locations
Experience: 3+ Years in IC Packaging & PCB Design
Notice Period: Immediate to 45 days
Description:As an IC Package Design Engineer, you will be responsible for executing high-density package layout designs across Intel's product portfolios (Test Chips, CPUs, Chipsets, SoC designs, Test Vehicles, and more).
Responsibilities:Using the Mentor Graphics Expedition PCB software to design the substrate in compliance with existing design rules, electrical requirements, and processes.
Respond to customer and/or client requirements or events as they occur.
Generating high-quality design documents promptly for manufacturers and package assembly modules.
Requirements:Bachelor's degree or 3+ years of work experience in related fields.
Experienced in using Package/Board CAD layout design and software tools such as Mentor Graphics Expedition PCB.
Must understand various interface requirements like DDR/PCIe/SERDES etc.
Good technical knowledge of electrical field theories and electronic fundamentals. Those with sound knowledge of electromagnetic and microwave theory are encouraged to apply.#J-18808-Ljbffr