Job Description : (Experience in Die Bond, Wire Bond, Encapsulation & Plating)
To lead a group of process technicians and process engineer to trouble shoot failure analysis, yield improvement, to monitor machine efficiency and make assembly process more robust covering the 4M (Man, Machine, Method & Material).
Responsibilities : To carry out failure analysisTo lead process engineer in order to sustain process yield and quality.To hold To work with R&D engineers on new product/process release in production. a meeting with SMT to improve assembly yieldTo carry out and coordinate all the yield improvement evaluation and fulfill the yield targetTo achieve process yield as per targetTo buy off all new equipmentTo support new machine setup and buy-off before phase in to production.To timely generate SOP for productionTo work out matter of screening of hold tag lot / mavericks lot.To work with production to prevent quality issue occur at line with containment action and permanent corrective action items in-place.To work and update with Quality team on the issue related to internal and external cases.To drive CI project on those high defect issueRequirements; Bachelor Degree in Electronic/Mechanical Engineering.Experience in semiconductor will be advantage.>3 years experience in Manufacturing or process engineering positionWork independentStrong problem solving skill.Good interpersonal skills and positive attitude.By providing your personal data to us, you are consenting to the terms and conditions of this Privacy Notice and the collection, use, access, transfer, storage and processing of your personal data as described in this Privacy Notice. If you do not wish to give us this consent, kindly notify us in writing. Failure to consent to the terms and conditions of this Privacy Notice will result in us being unable to process your application for employment, to communicate with you and/or to properly discharge certain administrative functions in relation to your employment.