Mgr Sr, Process Engineering

Job Title: Process ManagerWe are seeking a highly skilled and experiencedProcess Managerwith expertise in die bond, wirebond, and Front of Line processes in the semiconductor industry. The ideal candidate will have a strong background in managing and optimizing processes.
Key Responsibilities:
Lead a group of Assembly process and process engineering, driving for operation KPI such as Quality, Cost, Yield, Productivity, and Equipment OEE.
Partner with Manufacturing to drive for Output, OTD, LOH, and Cycle time.
Lead and guide engineers for continuous improvement of operation KPIs using DMAIC.
Develop and implement process improvements for Front of Line, especially for die bond and wirebond processes to increase efficiency and yield.
Manage and oversee the day-to-day operations of the production lines, including Front of Line and End of Line processes.
Collaborate with cross-functional teams to troubleshoot and resolve any issues related to semiconductor manufacturing processes.
Ensure compliance with industry standards and regulations for all stages of semiconductor manufacturing.
Train and mentor team members on best practices for Front of Line, End of Line, die bond, and wirebond processes.
Monitor and analyze key performance indicators to track the success of semiconductor manufacturing processes.
Qualifications:
Degree in Engineering.
Minimum of 5 years of experience in die bond, wirebond, Front of Line processes in the semiconductor industry.
Proven track record of successfully managing and optimizing semiconductor manufacturing processes.
Strong analytical and problem-solving skills.
Excellent communication and leadership abilities.
Ability to work effectively in a fast-paced and dynamic environment.#J-18808-Ljbffr