Texas Instruments Electronics Malaysia Sdn Bhd 4.2 141 reviews · View all jobs
Change the world.
Love your job.
As a member of our packaging team, you'll have the chance to interact with many product groups and functions.
You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
Responsibilities may include:
Partnering with TI's internal Power businesses to design and develop innovative power module packaging technologies, focused on miniaturization and integration:
Define and validate design rule roadmaps for multi-PCB power modules/sub-systems with vertical integration
Review and approve power module designs
Define and validate materials and process flows for these sub-systems
Define learning cycles and establish a robust assembly flow for new power modules
Guide the factory engineering team during qualification and production ramp of these sub-systems
Review assembly line quality and compliance
Lead discussions with customers on manufacturing and reliability aspects of power modules
Why TI?
Engineer your future.
We empower our employees to truly own their career and development.
Come collaborate with some of the smartest people in the world to shape the future of electronics.
We're different by design.
Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger.
We value each and every voice, and look forward to hearing yours.
Benefits that benefit you.
We offer competitive pay and benefits designed to help you and your family live your best life.
Your well-being is important to us.
About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
At our core, we have a passion to create a better world by making electronics more affordable through semiconductors.
Minimum Qualifications:
Bachelor's degree in Mechanical Engineering, Electrical Engineering or Materials Engineering
Minimum 10 years of relevant experience
Preferred qualifications:
Experience with:
packaging/assembly of power semiconductors
multi-PCB module assembly process
vertical integration of disparate components
reliability & manufacturability of electronic sub-systems/modules
directing materials & process flows in AT sites
mechanical & thermal modeling of power modules
Ability to establish strong relationships with key stakeholders critical to success, such as:
sub-contractor and internal assembly sites
global design and manufacturing teams
component suppliers
Strong verbal and written communication skills
Working knowledge of engineering CAD tools
How do your skills match this job?If you are interested in this position, please apply to this requisition.
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.#J-18808-Ljbffr