Launch your career in the dynamic world of semiconductor manufacturing with this PGDM Die Aggregation Engineering internship at Intel! Based in Penang, Malaysia, you'll gain valuable hands-on experience supporting the assembly and testing processes of Intel's cutting-edge technology. You'll collaborate with experienced professionals, contribute to maintaining world-class quality standards, and play a vital role in bringing Intel products to life.
QualificationsCurrently pursuing a Post Graduate Diploma in Management (PGDM) with a specialization in Engineering Management, Manufacturing Engineering, or a closely related field.
Prior experience in a manufacturing environment or a strong understanding of production processes is a plus.
Familiarity with quality control principles and procedures is beneficial.
Strong analytical and problem-solving skills with a keen eye for detail.
Excellent communication and interpersonal skills to collaborate effectively within a team environment.
Ability to work independently and take initiative in assigned tasks.
ResponsibilitiesAssist with the setup, installation, and qualification of module tools and equipment used in the die aggregation process.
Analyze data and identify potential issues to ensure smooth production flow and high-quality output.
Participate in process improvement initiatives, suggesting and implementing strategies to optimize efficiency and yield.
Support the development and maintenance of technical documentation related to die aggregation processes.
Work closely with quality control engineers to ensure adherence to rigorous quality standards and specifications.
This internship provides a unique opportunity to acquire practical skills in die aggregation engineering at a leading semiconductor manufacturer. You'll work alongside industry experts, contribute to Intel's commitment to excellence, and gain valuable experience in a fast-paced and technologically advanced environment.#J-18808-Ljbffr