Penang, Malaysia Job ID JR0250624 Job Category Manufacturing and Process Development Work Mode On-site Required Experience Level Experienced Full/Part Time Full Time
Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors.
The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for nearly five decades. Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth. Responsibilities will include, but are not limited to:
Be part of the pioneer team in leading ramping Intel's latest Advanced Packaging technologies from process start-up to high volume manufacturing.
Plans and implements capacity, and operational improvements to deliver world-class performance on critical success indicators (Safety, Quality, Output and Equipment performance) in a highly automated production facility.
Sustain semiconductor fab processes/equipment for wet etch/clean processes
Establish equipment maintenance controls, review and perform regular update of PM procedures, Risks Assessments and Troubleshooting guidelines.
Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products
Establish sufficient essential spares and consumables stock levels to support equipment maintenance.
Interacting with partner factories worldwide to transfer new equipment/processes, maintain CE (copy exactly) parameters, best known method learnings and drive strategic improvement projects.
Provide sustainable training and coaching and leading 24/7 manufacturing technician team to troubleshoot and resolve equipment and process issues.
Qualifications BS/MS in Chemical/Mechanical/Mechatronic/Electrical Engineering or equivalent, with industry experiences in semiconductor field.
Minimum 3 to 7 years' experience in Frontend Semiconductor Fab in equipment and process engineering for Wet Etch/Clean.
Excellent communication skills with a high tolerance for ambiguous and dynamic situations.
Demonstrated learning mindset on new equipment and process competency building.
Ability to work fast and agile in a matrixed environment and build cohesive teams.
Proven track record in technical problem solving and able to provide solution to overcome complex technical challenges.
. Experienced tool vendors who involved in tool installation/ramp readiness for a start-up fab are highly encouraged to apply.
Inside this Business Group Job Description Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors.
The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for nearly five decades. Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth. Responsibilities will include, but are not limited to:
Be part of the pioneer team in leading ramping Intel's latest Advanced Packaging technologies from process start-up to high volume manufacturing.
Plans and implements capacity, and operational improvements to deliver world-class performance on critical success indicators (Safety, Quality, Output and Equipment performance) in a highly automated production facility.
Sustain semiconductor fab processes/equipment for wet etch/clean processes
Establish equipment maintenance controls, review and perform regular update of PM procedures, Risks Assessments and Troubleshooting guidelines.
Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products
Establish sufficient essential spares and consumables stock levels to support equipment maintenance.
Interacting with partner factories worldwide to transfer new equipment/processes, maintain CE (copy exactly) parameters, best known method learnings and drive strategic improvement projects.
Provide sustainable training and coaching and leading 24/7 manufacturing technician team to troubleshoot and resolve equipment and process issues.
Qualifications BS/MS in Chemical/Mechanical/Mechatronic/Electrical Engineering or equivalent, with industry experiences in semiconductor field.
Minimum 3 to 7 years' experience in Frontend Semiconductor Fab in equipment and process engineering for Wet Etch/Clean.
Excellent communication skills with a high tolerance for ambiguous and dynamic situations.
Demonstrated learning mindset on new equipment and process competency building.
Ability to work fast and agile in a matrixed environment and build cohesive teams.
Proven track record in technical problem solving and able to provide solution to overcome complex technical challenges.
. Experienced tool vendors who involved in tool installation/ramp readiness for a start-up fab are highly encouraged to apply.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in theTechnology Development and Manufacturing Groupare part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth. Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Working Model
This role will require an on-site presence.
"I've always wanted to do something that changes the world — at Intel, I feel appreciated, and I've gained more confidence in myself. It makes me feel like I'm capable of doing great things."
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