The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources.
The Business Unit can look back on almost fifty years of production and development expertise.
Responsibilities:To initiate package concepts, own and drive advanced package selection, new product package structure and configuration optimization.
Work with cross functional team and lead package integration efforts.
Drive industry with advanced Package solutions, new material development, and specs.
To ensure self development to continually upgrade overall performance by maintaining organizational knowledge through design guideline, simulation, design rules, supplier capability, knowledge management system & actively participating in internal and external knowledge sharing (Technical symposium, trade shows, etc).
Minimum Requirements:Bachelor or higher Technical Degree (e.g Electrical, Mechanical, Chemical, Material, Physics, etc.)
Minimum 5 years in packaging (Package architecture / Package integration Innovation)
Hands-on working knowledge and experience with AutoCAD or a related 3D modeling application(s)
Has working knowledge in materials characterization and analysis
General understanding of packaging technologies, knowledge of wafer level packaging, assembly processes, packaging materials, reliability standards, FA techniques, simulation etc.
Prior experience with semiconductor assembly operations
Exposure to automotive packaging is a plus
Good engineering problem-solving skills with strong engineering physics and fundamentals
Good communication skills that can enable the candidate to work well with internal cross functional teams and overseas suppliers
Good program management skill#J-18808-Ljbffr