We are an electrical and electronic engineering company with the primary focus of manufacturing memory-related products. At GL Tech, we empower our people to be leaders of tomorrow by giving them the sufficient autonomy to be creative and innovative. We also provide equal opportunities to all job-seekers and foster a respectful and ethical working culture.
About the job :
Your role as the SMT/BGA Process Engineer will primarily be responsible for evaluating, implementing and monitoring processes and operating systems for the SMT/BGA department. The SMT/BGA Engineer is also involved in providing all aspects of SMT/BGA engineering support in the day-to-day manufacturing environment. You should be able to display great communication and teamwork skills with the ability to adapt to different scenarios. Your key responsibilities are as follows:
Designing and optimising SMT/BGA assembly processes, including component placement, soldering, and inspection.
Troubleshooting and resolving issues during SMT/BGA production, such as solder defects, component placement errors, and equipment malfunctions.
Staying up-to-date with the latest SMT/BGA equipment, techniques, and industry standards.
Select, install, and maintain SMT/BGA equipment, including pick-and-place machines, reflow ovens, stencil printers, and inspection systems.
Continuously improve and fine-tune existing processes to minimise defects and increase yields.
Ensure proper storage and handling of materials to prevent contamination and defects.
Identify opportunities for cost reduction through process improvements, material substitutions, or efficiency enhancements.
Create and maintain detailed process documentation, including work instructions, process flowcharts, and equipment manuals.
Job requirements:
Bachelor's degree in a technical, electrical or electronic discipline or related field
Minimum of 3 years of working experience with SMT and BGA processes and equipment.
Must be able to operate SMT/BGA automatic assembly equipment: Jet Printer, Pick & Place, Vapor Oven, Selective Soldering, Reflow Oven, AOI (automatic optical inspection) and Flying Probe.
Must be able to troubleshoot and repair SMT/BGA equipment.
Must be able to provide programming and technical support for SMT/BGA process equipment.
Proficiency in English, Malay and Chinese is required.
You must be able to read Chinese as the machines are programmed in the Chinese language.#J-18808-Ljbffr