Details of the offer

Electrical/Electronic Engineering (Engineering)
Full time
Lead the Strategic Technical Direction and manage the Technology Center for Research & Development (R&D). Provide leadership in developing and implementing strategies for R&D, including modeling, simulation, and managing the R&D Pilot Line.
Key Responsibilities:
Lead strategic initiatives to develop and commercialize innovative technologies and align with corporate roadmaps.
Establish and strengthen critical internal capabilities to drive value engineering, cost reduction, and problem-solving.
Ensure Carsem's technology remains competitive by recommending and guiding Carsem Technology Center Programs.
Build and enhance the infrastructure needed to meet strategic development goals.
Manage patent processes for Carsem's M-site and S-site to protect intellectual property.
Interface with customers for new products, materials, and process development, focusing on speed, cost-effectiveness, and seamless manufacturing.
Oversee multiple product design teams to enable quick time-to-market at optimal costs.
Lead packaging solutions and provide in-depth customer presentations on technology.
Collaborate with design and production teams to assess and provide essential product design, assembly, and testing information.
Ensure the technical aspects of the company's strategy align with its business goals.
Advise management on new developments that may impact profitability, schedules, costs, or customer relationships.
Stay informed on new technologies that could improve operations and products and present recommendations.
Develop and enhance products for key market segments, driving growth into new markets.
Manage the R&D pilot line, ensuring efficiency and continuous improvement.
Any additional tasks assigned by management.
Job Requirements:
Education & Experience:
Bachelor's Degree in Computer Science, Software Engineering, Electrical & Electronic Engineering, Physics, or equivalent.
Minimum of 10-15 years of experience in the semiconductor industry.
Technical Knowledge & Skills:
Expertise in Assembly and Testing processes.
Strong understanding of IC packaging and materials.
Proficient in Project Management, from new product introduction to mass production.
Knowledge of lean manufacturing and manufacturing operations.
Business planning and budget management skills.
Strong interpersonal skills, capable of building and maintaining positive relationships with peers, customers, and stakeholders.
Excellent project management and cross-functional leadership skills.
Assertive, proactive, and a team player.
Company Overview:
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week, with more than 65% of this volume shipped as fully tested product.
We operate three high technology factories, two in Ipoh, Malaysia, and one in Suzhou, China, ensuring quality products that meet the exacting standards of the automotive, telecom, computer, and consumer goods industries.
Vision:To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World.
Mission:Carsem will continue to show profitable growth with emphasis on employee development and operational and service indices to ensure that we are the Employer Of Choice and Supplier Of Choice.
Quality Policy:Carsem's policy is to provide products and services of the highest quality through a preventive quality culture. Employees will act with honesty, sincerity, and operate as a team to continuously strive for improvements in quality, productivity, delivery, services, and cost.#J-18808-Ljbffr


Nominal Salary: To be agreed

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