Full-time
Job Type (exemption status): Exempt position - Please see related compensation & benefits details below
Business Function: Packaging Engineering
Company DescriptionAt Western Digital, we are on a mission to unlock the potential of data so people, companies and organizations everywhere can create what's next.
To fulfill our vision, we are always on the lookout for potential team members who share our passion for solving problems to empower others.
When you join Western Digital, you join a legacy more than 50 years in the making.
Across our Western Digital, SanDisk, SanDisk Professional, WD and WD_BLACK brands, we have brought some of the most storied advancements in memory and data storage technology to market—and our best, most innovative work is yet to come.
From energizing gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world's biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.
Here's how you can help.
Job DescriptionESSENTIAL DUTIES AND RESPONSIBILITIES:
Responsible for Die Attach New Process Development for new product and process development.
Supports New Product Introduction by delivering assigned Process and Equipment solutions meeting quality, development, and operation targets and requirements.
To design, develop, and implement innovative AI/ML tools and applications aimed at effectively addressing and optimizing process challenges.
Setup new Die Attach processes, recipe, perform complete window study, DOEs, corner limits.
Process Qualification to meet process Critical to Quality Requirements, CPK, Full risk assessment, UPH, Yield, and Cost targets.
Work closely with Cross site's Product development & design team to understand the Package Design Rules & Requirements.
New process development for new wafer technology, next generation products, new material / machine / tooling / software qualifications.
Define Leading edge Die Attach Technology Roadmap / building block.
Ensure effective handshake / pass over of process for New device / product introduction to the High Volume Manufacturing.
Support new material (DAF) and tools (rubber tip/ejector) qualification.
Strong problem-solving skills and good Root Cause Analysis / Finding using 5M + 1E, 5 whys, DMAIC, 8D approach / methodology.
Knowledgeable in production control processes, SPC, Data Analysis / Interpretation GR&R, Cp/Cpk and correlation analysis, MSA.
Report any non-conformance / customer complaint issue and develop / follow up the improvement actions.
Create and maintain documentation, including SOPs, work instructions, FMEAs, OCAPs, and control plans related to the process.
QualificationsREQUIRED:
Bachelor or higher Engineering degree in Mechanical / Mechatronics / Electronics / Physics & etc.
Specialization or coursework in AI / ML / Data Science will be added advantages.
More than 3 years of hand-on experience in Die Attach process development preferred.
SKILLS:
Hand-on experience in Renesas / Fasford / Canon die bonder is a plus point.
Proficiency in data analytics & strong problem-solving with statistical analysis skills (DOE, SPC, and AI-driven methodologies).
Self-motivated, possess initiatives and ability to lead and work independently.
Good project planning, strong sense of quality and urgency.
Team player with good communication and interpersonal skills.
Additional InformationWestern Digital thrives on the power and potential of diversity.
As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within.
We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us.
We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.#J-18808-Ljbffr