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ResponsibilitiesResponsible for Die Attach New Process Development for new product and process development.
Supports New Product Introduction by delivering assigned Process and Equipment solutions meeting quality, development, and operation targets and requirements.
To design, develop, and implement innovative AI/ML tools and applications aimed at effectively addressing and optimizing process challenges.
Setup new Die Attach processes, recipe, perform complete window study, DOEs, corner limits.
Process Qualification to meet process Critical to Quality Requirements, CPK, Full risk assessment, UPH, Yield, and Cost targets.
Work closely with Cross site's Product development & design team to understand the Package Design Rules & Requirements.
New process development for new wafer technology, next generation products, new material / machine / tooling / software qualifications.
Define Leading edge Die Attach Technology Roadmap / building block.
Ensure effective handshake / pass over of process for New device / product introduction to the High Volume Manufacturing.
Support new material (DAF) and tools (rubber tip/ejector) qualification.
Strong problem-solving skills and good Root Cause Analysis / Finding using 5M + 1E, 5 whys, DMAIC, 8D approach / methodology.
Knowledgeable in production control processes, SPC, Data Analysis / Interpretation GR&R, Cp/Cpk and correlation analysis, MSA.
Report any non-conformance / customer complaint issue and develop / follow up the improvement actions.
Create and maintain documentation, including SOPs, work instructions, FMEAs, OCAPs, and control plans related to the process.
QualificationsREQUIRED:
Bachelor or higher Engineering degree in Mechanical / Mechatronics / Electronics / Physics & etc.
Specialization or coursework in AI / ML / Data Science will be added advantages.
More than 3 years of hand-on experience in Die Attach process development preferred.
SkillsHand-on experience in Renesas / Fasford / Canon die bonder is a plus point.
Proficiency in data analytics & strong problem-solving with statistical analysis skills (DOE, SPC, and AI-driven methodologies).
Self-motivated, possess initiatives and ability to lead and work independently.
Good project planning, strong sense of quality and urgency.
Team player with good communication and interpersonal skills.
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Consumer Electronics Manufacturing 1,001-5,000 employees.
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