Senior Process Engineer (Wire Bond / Plating)

Senior Process Engineer (Wire Bond / Plating)Responsible for semiconductor assembly engineering activities to support high volume production requirements.
Conduct process optimizations, evaluations, process mapping and design of experiments to improve production yield, quality and cost of manufacturing.
Assess quality of suspect materials and provide dispositions.
Analyze day-to-day process issues. Work on improving detection of problems and implementing preventive actions.
Interface with customers to support new package development or address customer feedback.
Identify and implement value engineering activities to improve the package assembly processes for cost effectiveness.
Requirements:
Bachelor's Degree in Engineering, Applied Physics, Applied Chemistry or a relevant course.
Preferably with more than 3 years' experience in the semiconductor industry or with similar job responsibilities.
Knowledge in DOE and SPC is beneficial.
Must be independent and self-motivated.
Strong analytical, communication and interpersonal skills.
Fluent in spoken and written English.
Mandarin speaking and writing proficiency will be an added advantage to liaise with respective customers.
To be based in Simpang Pulai or Gopeng, Perak.#J-18808-Ljbffr