Engineering - Software (Information & Communication Technology)
Full time
Lead the design, development, and implementation of complex software solutions for automation systems.
Independently troubleshoot and debug critical software issues.
Provide technical leadership and mentorship to junior engineers.
Collaborate with cross-functional teams (mechanical design, hardware design, sales and marketing) to define technical roadmaps and translate business goals into robust software architecture.
Champion best practices in software development and ensure code quality through code reviews and technical guidance.
Job Requirements:Bachelor's Degree in Automation / Robotics / Mechatronic / Computer Science.
Minimum 3 years of experience in software development under automation environment.
Experience with Visual Studio platform development, GIT.
Experience knowledge of object-oriented programming.
In-depth expertise in programming languages C# and dot net frameworks.
Solid understanding of SDLC methodologies and experience in leading agile development teams.
This role necessitates proficiency in Mandarin due to the need for frequent travels and interaction with Mandarin-speaking clients. Successful candidates must be able to communicate effectively in Mandarin to facilitate business operations and client relations.
Your application will include the following questions:
What's your expected monthly basic salary?
How many years' experience do you have as a software engineer?
Which of the following programming languages are you experienced in?
Which of the following languages are you fluent in?
How much notice are you required to give your current employer?
Which of the following types of qualifications do you have?
Are you willing to travel for this role when required?
NSW Automation is a leading global company specializing in precision fluid dispensing systems in today's global microelectronics and semiconductors industries. We are Malaysian based and headquartered in Penang.
We have created the world's smallest solder paste micro-dispensing solution for achieving remarkably tiny dispensed dots or lines size as small as 80µm which are extremely demanding in today's microelectronics packaging industry such as 5G devices, MEMS, SiP or PoP packages, and even active and passive components like 01005, 008004 assemblies in Hybrid SMT assembly process. Other than solder paste, our micro-dispensing solutions are applicable for multiple materials such as conductive silver epoxies, UV adhesives, silicone gel, etc.
We have wide business footprints and branches around the world with professional sales and technical service authorities in the USA, China, Taiwan, South Korea, SEA countries, Germany, Russia, and many more.
With more than 15 years of shaping our experience in the advanced dispensing industry, we are passionate about delivering high performance and reliable precision liquid dispensing solutions to support our customers' automated dispensing needs.#J-18808-Ljbffr