Drive leadframe/packing material development activities to ensure the package fulfills all requirements in the aspect of manufacturing, product qualification and reliability.In your new role you will:Be the technical expert for package development projects' leadframe/packing material.Perform design,drawing and specification for leadframe based on design guideline, assembly rules and ensure design for manufacturing, quality and cost.
Collaborate with internal and material supplier on packing material design, specification and selection; and ensure design for manufacturing, quality and cost.Drive leadframe/packing material development activities and ensure fulfilment of project milestone deliverables, cost and documentation release (spec, drawing, GIMM, etc).Liaise with SQM and supplier to ensure fulfilment of quality requirement/FAI for leadframe/packing material; and qualification release.Establish design guidelines/requirements for leadframe/packing material specification.Generate technical papers/journals and patents related to lead frame/package design that enhance technical value.Support incoming material quality, work with suppliers/internal to resolve technology/quality issues, improvement programs, etc.
Involve in leadframe/packing material technology road mapping, UPEG activity, material selection to meet roadmap requirement.
Actively engages with leadframe/packing material suppliers to explore new technology, and best-in-cost design to achieve competitive advantages.You are best equipped for this task if you have:Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).At least 7 years of working experience in semiconductor assembly and packaging development; and relevance experience in leadframe/packing material is preferred.Leadframe design/packing material development & qualification.Drafting/designing (2D/3D) leadframe using AutoCAD/Inventor.Knowledge in material physics/properties for leadframe and packing material.GD&T knowledge/material specification definition.Basic semiconductor packaging, assembly and test.BenefitsWide range of training offers & planning of career developmentInternational assignmentsDifferent career paths: Project Management, Technical Ladder, Management & Individual ContributorExempt working hours are flexible within core hours (9am-12pm & 2pm- Home office options for certain tasks or due to personal circumstances.
Applicable to exempt employees working on office hours onlyPart-time work possible for exempt employees onlyExempt staff could apply up to 3-month sabbatical leave, subject to business situationMedical coverageIn-house clinic operates 24 hours, doctor consultation possible from 9am to 5pmHealth promotion programsSocial Recreation Center with facilities, such as gym room, squash, badminton and netball court, zumba and yoga classes, etc.On-site CafeteriaPaid sick leave according to lawAdditional 3% to Employee Provident Fund after 10 years service with Infineon MalaccaRe-employment opportunitiesProductivity incentive bonusBus service for shift employees Allocated carpark for disabled and pregnant employees
