Our vision is to transform how the world uses information to enrich life for all.Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.JR46999 Sr/Engineer, PDE Technology DevelopmentMicron is seeking a highly motivated and experienced individual contributor to join our Assembly Package Technology Development (TD) team.As a Sr/Engineer in the Process Development team, you will be crucial in developing and qualifying new materials, equipment, and wafer tech nodes for Micron's world-class products and devices.Job Responsibilities:Primarily responsible for Cleanroom 3 Area processes (Pre-Encapsulation Plasma / Encapsulation / Post Mold Cure / Laser Marking / Ball Attach / Reflow / Flux Washer / Package Singulation / Assembly Open and Short Test).Development and Qualification of new direct and indirect materials, new equipment, and new wafer tech nodes.Ensure product quality and process performance while driving projects focused on cost reduction, productivity improvement, risk mitigation, and resolving manufacturing challenges.Collaborate or lead teams from various departments to ensure smooth development transfer to all Micron network sites.Familiarize and implement PMI (Product Maturity Index) methodology and provide accurate documentation for product transfer.Develop, configure, and optimize Package Assembly processes (Front End, Bonding, and Back End) for Micron's memory products from pathfinding to NPI start-up and certification.Collaborate with Design teams globally in the development of assembly design rules, involved in the design approvals (Substrate and Silicon), running, testing and upgrading systems and processes, and approving materials, process, and equipment changes in the CCB (change control board).Requirements:Masters/bachelor's degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics, or equivalent work experience required.At least 5 years of experience in the semiconductor industry with proven knowledge and skills in Pre-Encapsulation Plasma / Encapsulation / Post Mold Cure / Laser Marking / Ball Attach / Reflow / Flux Washer / Package Singulation / Assembly Open and Short Test.Excellent problem-solving skills and familiarity with data-driven analysis, statistical analysis, and data interpretation.Strong project management skills and ability to multitask to ensure the execution of timelines.Strong collaboration skills to work closely with diverse teams and gain insights into business needs and customers' requirements.Deep fundamental understanding of key risks in the Cleanroom 3 processes
