WHAT YOU DO AT AMD CHANGES EVERYTHING
We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world's most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.
AMD together we advance
THE ROLE:
Physical design including block level place/cts/route, full chip floor planning, timing closure, physical verification etc.
THE PERSON:
Always be positive, dedicated and a good team player
Good listening, writing, and speaking English
Good communication skills
KEY RESPONSIBILITIES:
Work with global Front-End design team and physical design team for large scale ASIC chip physical implementation.
Focus on physical design of deep sub-micron GPU chips including block level, full chip floor planning, timing closure, place and route, physical verification etc.
The individual is expected to be an expert in multiple aspects in PD areas and provide technical leadership to the engineering team.
The individual is also expected to be accountable for project delivery.
PREFERRED EXPERIENCE:
Tape-out experience in deep submicron process
Knowledgeable in all aspects of ASIC design flow
Demonstrate strong leadership and work well with cross-functional teams
Familiar with Unix/Linux environment
Familiar with Back-End (physical design) EDA tools
Familiar with Front-End EDA tools
Good at scripts, like Python/perl/Tcl/shell
ACADEMIC CREDENTIALS:
MSEE / Microelectronic preferred
MSEE with 3+ years or Bachelor with 5+ years of industrial experience in ASIC design.
LOCATION:
Penang, Malaysia#J-18808-Ljbffr