Job Description:Collaborate with the burn in board/Apps design team to drive the readiness of automotive burn in hardware, ensuring seamless operation in external burn in facilities.
Coordinate with package houses (OSATs) and external burn in labs to oversee smooth Automotive burn in operations, requiring regular travel for on-site support, debugging, and troubleshooting of burn in hardware and related tests.
Conduct hands-on debugging and troubleshooting of burn boards and other relevant Rel hardware at external burn in facilities.
Analyze reliability test results using TIBCO Spotfire and other statistical software, promptly identifying and escalating any quality issues.
Collaborate with the FA team to pinpoint root causes, ensuring timely corrective actions at Burn In house and OSATs.
Manage all documentation related to Automotive burn in and generate comprehensive reports.
Provide support to reliability evaluations and reliability qualification projects.
Requirements/Qualifications:BS or MS degree in Electrical Engineering with a minimum of 8-10 years of hands-on experience in Reliability Engineering at a company that develops, manufactures, and supplies integrated circuits.
Must have a strong background and hands-on experience in semiconductor device reliability tests and procedures, including HTOL, THB, HTRB, HALT, TC, and various accelerated lifetime tests.
Preferably, experience with ESD HBM, ESD CDM, and Latch-up Test.
In-depth knowledge of automotive reliability standards (AEC).
Candidates that have experience with high voltage products with GaN, SiC, and other semiconductor power devices will be given preference.
Hands-on with Reliability hardware and system level troubleshooting, ATE data review, and Statistical analysis.
Excellent communication skills, with a track record of producing detailed reports and presenting technical data to cross-functional teams.
In-depth knowledge of IC components reliability failure modes, mechanisms, and failure analysis techniques is required.#J-18808-Ljbffr