Staff Engineer, Technology Development Quality & Reliability EngineeringFull-time
Job Type (exemption status): Exempt position - Please see related compensation & benefits details below
Business Function: Packaging Engineering
The future. It's on you. You & Western Digital.
We've been storing the world's data for more than 50 years. Once, it was the most important thing we could do for data. Now we're helping the world capture, preserve, access and transform data in a way only we can.
The most game-changing companies, consumers, professionals, and governments come to us for the technologies and solutions they need to capture, preserve, access, and transform their data.
But we can't do it alone. Today's exceptional data challenges require your exceptional skills. It's You & Us. Together, we're the next big thing in data.
Western Digital data-centric solutions are found under the G-Technology, HGST, SanDisk, Tegile, Upthere, and WD brands.
The Staff Engineer defines, develops and qualifies new semiconductor packages and maintains quality of existing packages.
Represents Package Engineering in cross-functional teams and ensures that packages are characterized, qualified and introduced into production in a timely manner while meeting all electrical, performance, reliability and quality requirements.
Take responsibility for product DPPM, as well as new Technology development programs and new NAND/ASIC development Quality and Reliability.
Develop a comprehensive quality guidance library encompassing engineering work criteria, statistical Design of Experiments (DOE), Scorecard, sampling plans, and metric/methodology instructions.
Address quality cases in technology and product development using DMAIC, RCA, and 8DR methodologies.
Coordinates with factories worldwide on the high-volume introduction of new packages and assembly processes. Manages assembly yield improvement and package cost reduction programs.
Minimum Qualifications:
This position requires a candidate with MS / PhD degree in Mechanical/Materials Engineering.
Knowledge of semiconductor packaging highly desired.
Working knowledge of AutoCAD, Cadence APD, Finite Element Analysis, Design of Experiments, statistical techniques and package failure analysis techniques required.
Ability to multi-task and meet tight deadlines as well as excellent communication and interpersonal skills required.
Desired Skills:
Preferred candidate will have worked on projects related to semiconductor packaging from both mechanical and electrical integrity perspective.
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