Job Description ESSENTIAL DUTIES AND RESPONSIBILITIES: Equipment Operation: Operate and maintain SMT/FCA/UF equipment such as solder printer, solder paste inspection, 2D/3D automated optical inspection, chip shooter, reflow/curing oven, deflux cleaner, flip chip bonder, underfill dispenser, carrier machine, and plasma machine (All SMT/FC/UF tools).
Process Monitoring: Monitor and control the SMT/FCA/UF processes to ensure adherence to specifications and quality standards.
This includes validating defects and ensuring process parameters are within established limits.
Troubleshooting: Identify and resolve issues related to SMT/FCA/UF processes and assist equipment alarm related to the Recipe/Program.
Technical Support: Provide technical support to production teams, troubleshoot process-related issues, and root cause definition, and implement corrective/preventative actions to ensure continuous operation.
Collaboration: Work closely with engineers, quality assurance, and other technicians to optimize processes and resolve issues.
Provide feedback and suggestions for process enhancements.
Defect Analysis: Perform detailed analysis of defects observed in substrate assembly, flip chip wafer, underfill epoxy and collaborate with engineering teams to determine root causes and implement corrective actions.
Qualifications REQUIRED: Certificate / Diploma in Electrical & Electronic / Mechatronic or Equivalent.
Must be able to work in 12-hour rotational shift Able to read, write, and converse in English and Bahasa Malaysia PREFERRED: Familiarity with computer system & computer network Familiarity with MS Excel, Word, PowerPoint & Outlook Able to work independently Have a good interpersonal skill Knowledge of Datacon, Nordson, or Fuji machines.
SKILLS: Knowledge of Basic Troubleshooting Flow (Machine Operations) Knowledge in Surface Mount Technology (SMT), Flip Chip Assembly (FCA), Underfill (UF) Additional Information Western Digital thrives on the power and potential of diversity.
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