Job Type (exemption status): Non-Exempt position - Please see related compensation & benefits details below
Business Function: Engineering Support
Company DescriptionAt Western Digital, we are on a mission to unlock the potential of data so people, companies and organizations everywhere can create what's next. To fulfill our vision, we are always on the lookout for potential team members who share our passion for solving problems to empower others.
When you join Western Digital, you join a legacy more than 50 years in the making. Across our Western Digital, SanDisk, SanDisk Professional, WD and WD_BLACK brands, we have brought some of the most storied advancements in memory and data storage technology to market—and our best, most innovative work is yet to come.
From energizing gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world's biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.
Here's how you can help.
Job DescriptionESSENTIAL DUTIES AND RESPONSIBILITIES:
Equipment Operation:Operate and maintain SMT/FCA/UF equipment such as solder printer, solder paste inspection, 2D/3D automated optical inspection, chip shooter, reflow/curing oven, deflux cleaner, flip chip bonder, underfill dispenser, carrier machine, and plasma machine (All SMT/FC/UF tools).
Process Monitoring:Monitor and control the SMT/FCA/UF processes to ensure adherence to specifications and quality standards. This includes validating defects and ensuring process parameters are within established limits.
Troubleshooting:Identify and resolve issues related to SMT/FCA/UF processes and assist equipment alarm related to the Recipe/Program.
Technical Support:Provide technical support to production teams, troubleshoot process-related issues, and root cause definition, and implement corrective/preventative actions to ensure continuous operation.
Collaboration:Work closely with engineers, quality assurance, and other technicians to optimize processes and resolve issues. Provide feedback and suggestions for process enhancements.
Defect Analysis:Perform detailed analysis of defects observed in substrate assembly, flip chip wafer, underfill epoxy and collaborate with engineering teams to determine root causes and implement corrective actions.
QualificationsREQUIRED:
Certificate/Diploma in Electrical & Electronic / Mechatronic or Equivalent.
Must be able to work in 12-hour rotational shift.
Able to read, write, and converse in English and Bahasa Malaysia.
PREFERRED:
Familiarity with computer systems & computer networks.
Familiarity with MS Excel, Word, PowerPoint & Outlook.
Able to work independently.
Good interpersonal skills.
Knowledge of Datacon, Nordson, or Fuji machines.
SKILLS:
Knowledge of Basic Troubleshooting Flow (Machine Operations).
Knowledge in Surface Mount Technology (SMT), Flip Chip Assembly (FCA), Underfill (UF).
Additional InformationWestern Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.
Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at ****** to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.#J-18808-Ljbffr