Technician, Solder Joint Analysis

Details of the offer

Job Description Solder Joint Analysis (SJA) for NPI and sustaining testing phase Utilize FA tools such as X-ray, oscilloscope, curve tracer, microscope, CSAM, SEM, EDX, TDR, cross-sectioning, dye/pull techniques, and more for detailed analysis.
Generate SJA summaries based on findings and provide detailed reports to engineers.
Maintain and update SJA tracking sheets and equipment log sheets to ensure proper documentation.
Assist FA engineers with assigned tasks, supporting root-cause analysis and enhancing product reliability.
Qualifications Electrical, Mechanical or Chemical background with adequate knowledge on semi-conductor and SMT assembly process and technology Understand failure analysis methodology and flow such as X-ray, CSAM, SEM/DEX, chemical Decapsulation, cross-section and dye and pull.
Good communication skills Quick learning ability Additional Information All your information will be kept confidential according to EEO guidelines.
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We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us.
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Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process.
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Nominal Salary: To be agreed

Job Function:

Requirements

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