Wire Bond Engineer

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Responsibilities:Analyze low yield and QA rejection lots for disposition
Provide technical solutions to process issues.
Develop and Monitor Yield, Quality, Productivity Improvement Activities and Cost Reduction Programs
Improve process flow and update specifications to reflect changes by customers.
Responsible for process documentation, process spec, standard work instruction, OCAP etc.
Actively participate in NPI, operation, and quality meetings.
Quality Accountability:
i.
Disposition of Non-Conforming Product per Procedure.
ii.
Enforce compliance to mop and process specifications.
iii.
Enforce compliance and monitor process performance.
iv.
Establish a mop for a new process.
v. Root cause analysis and ensure data integrity.
vi.
Communicate Quality Alerts / Changes to Subordinates and Peers in A Timely Manner.Any other duties assigned by immediate superior.
Requirements:Degree in Engineering or equivalent
Minimum 2 years of working experience in NPI and/or Semiconductor Wire bond process.
Hands on wire bond process optimization & development
Familiar with basic SPC (Pareto analysis, Histogram, Trend analysis)#J-18808-Ljbffr