Backend Process Development Staff Engineer

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise. To lead cross functional projects related to LED assembly process improvement in FOL (die bond, wirebond) and die sort. Identify new possibilities and evaluate process technologies to improve yield and quality. Technical consultancy to Manufacturing eg. ? Task Forces Responsible to take over new disruptive assembly- front of line processes from RD into maturity. Responsible to create process standards for worldwide Manufacturing. Accountable for MF in X or Q-projects with respect to new processes equipment; Technical input to RD Contribution to Process Roadmap and Assembly Design Rules Involvement in hardware mechanical design for process improvement. Degree/Master in Material Eng/Mechanical Eng/electronics Eng/Physics/Manufacturing Eng min 5 years of experience in Semicondutor. Experience and knowledge in LED Assembly process equipment technologies in FOL processes (die bond, wirebond) and die sorting.Technical know how in hardware mechanical design is an added advantage. min 5 years in Process Development/Engineering with good project management .Good Data Analytical and Interpretation skills. Experience knowledge in process material interaction study analysis. Good industrial knowledge of LED assembly equipment process suppliers Hands-on experiences in Die Bond (Epoxy or Eutectic), Wirebond, Die sorting, Equipment development. Statistic Analysis 6 sigma, Problem Solving. #J-18808-Ljbffr