Die Bond Technical Expert

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Die Bond Technical ExpertApply locations Seremban time type Full time posted on Posted 2 Days Ago job requisition id R-20010314
About the role
The Diebond Technical Expert is responsible for driving the diebond strategy in Nexperia BE.
What you will do
To assure that Nexperia has the right capabilities, aligned with package R&D roadmap.
To continuously drive improvements in capability and throughput together with the sites.
To create synergies between Nexperia's BE sites and make sure best practices are shared across.
To define the appropriate tooling design rules for the diebond area.
What you will need
Degree holder in Engineering related disciplines.
Preferably Mechanical, Mechatronic or Electrical engineering.
At least five (5) years of related working experiences in semiconductor manufacturing environment.
Skillful on Die bond assembly processes.
Experience with the main Diebond models in Semiconductor BE.
Familiar with Six-sigma techniques, FMEA, DOE and statistics.
Statistical analysis & quality and problem-solving tools.
E.g.
DOE, SPC, FMEA, 8D and Minitab etc.
Able to work in international work environment with ability to influence people through data.
Requires travel to Nexperia factories, partners and exhibitions.
Nexperia is an Equal Opportunity/Affirmative Action Employer.#J-18808-Ljbffr