Job ResponsibilitiesAnalyzing, maintaining, improving, and planning strategies in implementing quality manufacturing processes.
Assisting QA department audits, NPI (New Product Introduction), new equipment buy-off, etc.
Leading Engineering Group to achieve departmental goals in yield, quality, and cost.
Machine maintenance and improvement.
Team building and growth.
Improving and sustaining assembly yield, quality, and cycle time of products, enhancing overall productivity.
Coordinating, managing, and leading process and manufacturing engineers.
Liaising with QA on customer issues and incoming quality issues.
Initiating process improvements through effective evaluations of yield data and manufacturing defects, making adjustments to process equipment accordingly.
Monitoring and maintaining assembly yield within KPI targets.
Key involvement in improving systems to reduce scrap rates due to process excursions.
Programming, troubleshooting, and maintaining manufacturing process equipment as required to meet yield targets.
Supporting engineering initiatives in evaluating solders, epoxies, new equipment installations, and recommending tactical and strategic solutions.
Developing Manufacturing Work Instructions and production routes along with Engineering change orders implementation when applicable.
Improving process capability (Cpk), 2nd Optical Gate, and 3rd Optical Gate.
Supporting New Product Introduction.
Responsible for sustaining and improving the Die Pre/Die Attach/Wire Bond Process.
Overall knowledge of semiconductor manufacturing and ability to collect and analyze data to create engineering reports for new products and regular production.
Any other tasks assigned from day to day.
Minimum RequirementsPossess a recognized degree or master's degree in Chemical, Electrical, Material, Industrial, Electronics, Mechanical Engineering, or any related field.
3 to 8 years experience in Process Engineering (Sawing, DA, WB).
2 to 3 years experience in a similar capacity would be an asset; ability to speak Chinese is a plus.
Dynamic personality and good interpersonal skills.
Mastery of Microsoft Office Applications.
Good written and verbal presentation skills, able to present ideas, concepts, data, and plans with high confidence at team meetings and executive review meetings.
Good critical thinking and systematic problem-solving skills (e.g., DOE, 8D, DMAIC, Process Mapping, FTA, 5-Why, Fish Bone, IS-IS NOT, etc.).
Familiarity with statistical analytical software (JMP/Minitab) is an added advantage.
Familiarity with FOL equipment is an advantage.
Knowledgeable in SPC and Risk Management/FMEA.
Company Overview:AIC Semiconductor is an established company in the assembly and test of leaded packages such as PLCC, SOIC, VSOP, TSOP, PDIP, and BGA/CSP/MCM packages.
At AIC, we believe in rewarding every achiever and are committed to ensuring the long-term personal development of our people.
As we embark on future expansion, we need high-caliber, result-oriented team players to be part of our team.#J-18808-Ljbffr