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Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
JR67927 Package Device Product Engineer (PDPE) (Evergreen)
This role is within Package and Development Engineering (PDE) group of Micron. This is a global department with teams located in USA, Singapore, Malaysia, Taiwan, and India. As a PDPE (Package Device Product Engineer) in PDE at Micron Technology, Inc., you will be responsible to prepare for new DRAM, NAND or MNAND products and coordinate resources, testing, and analysis over the lifecycle of the product. You will run data analysis and modelling, create, and maintain root cause analysis documentation, analyze parametric, probe level (FE) and electrical test (BE) data and respond to failures. In this role, you will work with various TD & NPI (new product introduction) Engineering (EFA, PFA, Assembly) and Manufacturing groups to find the root causes of the failed units.
Responsibilities and Tasks
Enable new test signals in BE which would capture assembly related failures.
Work with Test Solution Engineering (TSE) & Product Engineering (PE) to ensure standardize test coverages & chars. Define Char limits, and approval of any test relatedchanges.
Development of newout-of-control-action-plan(OCAP) and its sustenance
Provide Lot disposition based on parametric data observation in case of out-of-control (OOC) trigger.
Ensure that Silicon & assembly process meets Product expectations by extracting and analyzing Probe and BE test data.
Participate in Phase Gate review meetings, presenting the data analysis and deciding on Phase Gate exits related to electrical Test data.
Analyze test failures, coordinating EFA & PFA to identify the root cause. Implement fixes for fails (Fab process or Design or Assembly Process)
Finding out the correlation of test failures to assembly process and updating the database with the signatures observed
Support Global and Local material review board (MRB) in case of excursions and RMA related to package intrinsic design. This includes analyzing electrical test data for root cause analysis (RCA) and assessing the health of the contained material.
Requirements (Must Have)
BE / MS/ MTech in Electronics, Device Physics, Applied Physics, Electrical
Sound knowledge of device physics
Knowledge in Engineering Statistics
Experience in data (electrical) analysis and modelling (JMP, Spotfire is a plus)
Experience in programming (Python or Perl)
Effective communication skills in written and spoken English
Good multitasking and organizational skills, able to make decisions in complex situations
Excellent problem solving and analytical skills
Requirements (Good to Have)
Experience in NAND / DRAM memory or related field
Knowledge in packaging assembly processes
Experience in fabrication processes, electrical characterization techniques, metrology techniques
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
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