Job Type (exemption status): Exempt position - Please see related compensation & benefits details below
Business Function: Development Engineering
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.
At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we've been doing just that. Our technology helped people put a man on the moon.
We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world's biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.
Binge-watch any shows, use social media or shop online lately? You'll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That's us, too.
We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital, G-Technology, SanDisk and WD brands.
Today's exceptional challenges require your unique skills. It's You & Western Digital. Together, we're the next BIG thing in data.
Job DescriptionGeneral Description:
Drive WD-PTDI (Package Technology Development & Integration) department key performance matrix accomplishment specifically in SSD (solid state drive) technology and product packaging quality and reliability development.
Apply effective development methodology with system close loop control.
Define phase gate and reliability requirements, goals, and milestones for all SSD product groups, stakeholder and customer.
Apply FMEA, Critical Thinking, Customer requirements and Industry standards for BiC (Best in class) in every development activity.
Develops SSD assembly and IC packaging processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements.
Develops new package and SSD Assembly process qualification programs.
Plans and conducts experiments to fully characterize processes throughout pathfinding, development and ramp from product quality and reliability perspective.
Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity, and safety utilizing formal education, experience, statistical knowledge, and problem-solving tools.
Establishes close loop validation and tracking systems.
Transfers process to high volume manufacturing and provide support in new factory start-up.
Maintains product quality & reliability while developing and introducing new technology, products and improvement.
Use data analytic to make product quality & reliability predictable.
Specific Role Description
Includes the following but not limited to:
Setting up a new DFM (Design for manufacturing) function within PTDI with mission toward ensuring high quality and reliability of SSD product, primary scope in Mechanical Assembly, labels and backend operations.
Establish effective system and floodgate to ensure the SSD product quality & reliability is fully validated with high confident margin.
Use big data and analytic to continuously improvise the development methodology and making SSD quality and reliability predictable.
Drive containment and preventive action on all technology Q&R risk using effective methodology, failure analysis and troubleshooting skills ex. 8D, FMEA, FA techniques, Yield tools, simulation.
Working hand in hand with internal and external stakeholders to deliver world class SSD assembly technology for current and incoming technology.
Innovate staging development, pathfinding project with 10x thinking to be a leader in industry for SSD assembly manufacturing in quality and reliability.
QualificationsThe PTDI team embodies a high performance culture, marked by highly analytical, attention-to-details, hyper-productive, highly hands-on individuals. They work together to solve difficult problems. They are innovative. They possess the elusive "complete ownership" characteristic and have strong engineering pride, always willing to go above and beyond.
Candidates with Minimum 3 years of experience in packaging assembly development and manufacturing quality and reliability would be an advantage.
Knowledge in FMEA, DMAIC, 8D, manufacturing shop-floor system, automatic process control, platform development methodology and failure analysis.
High creativity and initiative, with ability to work with various stakeholders and drive implementation.
SSD SMT-Assembly integration development.
SSD SMT-Assembly technology (equipment/process/metrology) pathfinding.
SSD SMT-Assembly Jigs/fixtures design/development for new components.
Component-board-drive interactions.
Factory emergency taskforce support.
BS engineering/science required plus 3 years of relevant work experience; MS plus 2 years; or PhD plus 1 year. Relevant work experience must be in engineering project management role within semiconductor industry. Academic studies must be in applicable field of engineering/science and demonstrate an academic record of excellence.
Demonstrated track record to rapidly analyze and solve complex engineering issues by pursuing a focused solution path with a clear understanding of the point of diminishing returns.
Proficient in statistical analysis towards problem solving and the use of Excel and JMP.
Demonstrated track record to summarize complex data sets for technical and non-technical audiences, elegant in DOE design and execution.
Highly self-motivated and self-directed with demonstrated ability to work well with people; have strong inter-cultural intuition.
Proven success leading technical team(s) in previous work experience.
Demonstrated track record working hands-on around technical product, process and equipment reliability (including metrology and semiconductor failure analysis techniques).
Strong verbal and written communications skills.#J-18808-Ljbffr