Job Summary:Power module assembly process development (Plasma cleaning, Adhesion promoter coating, Pressfit pin insertion, Glue dispensing/Case attach, Si Gel filling, Terminal welding). Technical Leadership on process technology development. Technical Leadership on responsible processes between PIDC and Manufacturing. Establish process POR through set up, feasibility and characterization followed by package development procedure.
Process development for Si-gel filled power module, transfer molded module is a plus:Capable to understand power module design and propose improvements from End of Line process.
Familiar with DFMEA, update DFMEA and generate PFMEA linked with DFMEA.
Familiar with Si glue/gel, pressfit pin and terminal welding (Ultrasonic).
Capability to define KPIV from failures modes.
Capability to define KPOV and generate output by analyzing process capability.
Responsible for providing technical report from FMEA failures mode based on statistical analysis (JMP, Minitab).
Effectively working with technical leaders to generate process deliverables (Control Plan, D/PMEA, etc).Technical Leadership on Assembly Process:Capable to initiate new processes and equipment working with technical leader and supplier.
Responsible for spec generation and buy-off.
Capable to create COO for new processes and equipment.
Capable for benchmarking on new and better processes/equipment which do not exist in the company.
Capability to create process technology roadmap.
Capability to generate new design rule based on characterization, working with technical leader and designer.
Capable to understand customer requirements, application and EHS.
Capable to find systematic solutions and improvement planning for process defects.
Supporting quality issues during production, effectively working with the manufacturing team.COE Line Equipment Maintenance and Management:Responsible for tooling and jig design, working with designer and suppliers for new tooling/jig design.
Responsible for equipment/tooling/jig readiness on time.
Leading process technicians/operators to do the right job.
Sharing process technical issues, results, and improvement plans with technical leaders.Requirements:Experienced year:Min. 10 years.
Experienced areas:Plasma cleaning, Adhesion promoter coating, Pressfit pin insertion, Si glue/gel filling, Case attach, terminal welding.
Design career or equipment engineering career is a plus.
Experienced packages:Si gel filled power module (Intelligent Power Module, Dual Side Cooling Module, Power Discretes).
Nationality:Local preferred.
Education:BS or MS degree.
Skills:Fluent in English communication.
Familiar with statistical software (JMP, Minitab).
Proficient in Auto-CAD and MS Office (PPT presentation).
Personal Characteristics:Self-motivated, independent, open-minded to communication, willing to take risks and manage effectively.#J-18808-Ljbffr