Job DescriptionJob Summary:
Technical Leadership on process technology development.
Technical Leadership on responsible processes between PIDC and Manufacturing.
Establish process POR through set up, feasibility and characterization followed by package development procedure.
ResponsibilitiesProcess development for Si-gel filled power module; transfer molded module is a plus.Capable to understand power module design and propose improvements from End of Line process.
Familiar with DFMEA, update DFMEA and generate PFMEA linked with DFMEA.
Familiar with Si glue/gel, pressfit pin and terminal welding (Ultrasonic).
Capability to define KPIV from failures modes.
Capability to define KPOV and generate output by analyzing process capability.
Responsible for providing technical report from FMEA failures mode based on statistical analysis (JMP, Minitab).
Effectively working with technical leaders to generate process deliverables (Control Plan, D/PMEA, etc).Technical Leadership on Assembly ProcessCapable to initiate new process and equipment working with technical leader and supplier.
Responsible for P.O spec generation and buy-off.
Capable to create COO for new process and equipment.
Capable for benchmarking on new and better process/equipment which do not exist in the company.
Capability to create process technology roadmap.
Capability to generate new design rule based on characterization, working with technical leader and designer.
Capable to understand customer requirements, application and EHS.
Capable to find systematic solutions and improvement planning for process defects.
Supporting quality issues during production, effectively working with the manufacturing team.COE Line Equipment Maintenance and ManagementResponsible for tooling and jig design, working with designer and suppliers for new tooling/jig design.
Responsible for equipment/tooling/jig readiness on time.
Leading process technician/operators to do the right job.
Sharing process technical issues, results, and improvement plans with technical leader.QualificationsRequirements:
Experienced year: Min.
10 years.
Experienced areas: Plasma cleaning, Adhesion promoter coating, Pressfit pin insertion, Si glue/gel filling, Case attach, terminal welding.
Design career or equipment engineering career is a plus.
Experienced packages: Si gel filled power module (Intelligent Power Module, Dual Side Cooling Module, Power Discretes).
Nationality: Local preferred.
Education: BS or MS degree.
Skills: Fluent in English communication, familiar with statistical SW (JMP, Minitab), Auto-CAD, and MS-office (ppt presentation).
Personal characteristics: self-motivated, independent, open-minded to communicate, willing to take risks and manage.
About Usonsemi(Nasdaq: ON) is driving disruptive innovations to help build a better future.
With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.More details about our company benefits can be found here:
We are committed to sourcing, attracting, and hiring high-performance innovators while providing all candidates a positive recruitment experience that builds our brand as a great place to work.Job InfoJob Identification 2501398
Job Category Engineering
Posting Date 06/16/2024, 04:37 AM
Degree Level Bachelors
Job Schedule Full time
Job Shift Day#J-18808-Ljbffr