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Responsibilities:Technical Leadership on process technology development.
Technical Leadership on responsible processes between PIDC and Manufacturing.
Establish process POR through set up, feasibility and characterization followed by package development procedure.
onsemi(Nasdaq: ON) is driving disruptive innovations to help build a better future.
With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Key Responsibilities:Process development for Si-gel filled power module, transfer molded module is plus.
Technical Leadership on Assembly Process.
COE Line Equipment Maintenance and Management.
Requirements:Experienced year: Min.
10 years.
Experienced areas: Plasma cleaning, Adhesion promoter coating, Pressfit pin insertion, Si glue/gel filling, Case attach, terminal welding.
Design career or equipment engineering carrier is plus.
Experienced packages: Si gel filled power module (Intelligent Power Module, Dual Side Cooling Module, Power Discretes)
Nationality: Local preferred.
Education: BS or MS degree.
Skills: Fluent with English communication, familiar with statistical SW (JMP, Minitab), Auto-CAD and MS-office (ppt presentation).
Personal characteristics: self-motivated, independent, open mind to communicate, willing to take risk and managing.
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Consumer Electronics Manufacturing More than 10,000 employees
To report a concern, please contact the anonymous onsemi Helpline at 1800 819976.#J-18808-Ljbffr