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Job DescriptionIn your new role you will:
Perform IC (complex functional) Electrical Failure Analysis (EFA) on wafer and package level starting from electrical verification, fault isolation and physical root cause analysis.
Prepare FA reports that can lead to root cause finding and corrective action to cross functional team.
Participate, lead and present FA results in cross functional meetings, projects, yield improvement, urgent and important meetings.
FA equipment / tool ownership.
Interface with designers, test, product, process integration and unit process engineers, problem solving team, CQM team to understand the analysis requirement.
Responsible for achieving EFA KPIs.
Setup of application board, product specific test methodology and localization capability.
CAD navigation, layout and schematic analysis to identify the failure location and hypothesis.
Responsible for Fault Tree Analysis (FTA) in case of no physical defect found.
Your ProfileYou are best equipped for this task if you have:
Academic qualification: Degree / Master / PhD in Electrical and Electronic Engineering.
Job experience: Advanced Electrical Failure Verification and Localization, i.e.
bench test integration, high power localization, high kV testing and probing, active probe, LIVA/TIVA; Advanced sample preparation, i.e.
wet/dry chemical, back side preparation, package preparation; Imaging, i.e.
optical, SEM and FIB (incl.
Voltage Contrast); Repackaging skill i.e.
Chip On Board, Manual Wire bonder; Basic CAD Navigation System; Semiconductor processing, fabrication and testing.
Leadership: No direct supervisory Responsibility, Provides on-the-job training to more junior colleagues.
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