Company Description
At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.
At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we've been doing just that. Our technology helped people put a man on the moon.
We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world's biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.
Binge-watch any shows, use social media or shop online lately? You'll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That's us, too.
We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital, G-Technology, SanDisk and WD brands.
Today's exceptional challenges require your unique skills. It's You & Western Digital. Together, we're the next BIG thing in data.
Job DescriptionSolder Joint Analysis (SJA) for NPI and sustaining testing phase.
Utilize FA tools such as X-ray, oscilloscope, curve tracer, microscope, CSAM, SEM, EDX, TDR, cross-sectioning, dye/pull techniques, and more for detailed analysis.
Generate SJA summaries based on findings and provide detailed reports to engineers.
Maintain and update SJA tracking sheets and equipment log sheets to ensure proper documentation.
Assist FA engineers with assigned tasks, supporting root-cause analysis and enhancing product reliability.
QualificationsElectrical, Mechanical or Chemical background with adequate knowledge on semi-conductor and SMT assembly process and technology.
Understand failure analysis methodology and flow such as X-ray, CSAM, SEM/DEX, chemical Decapsulation, cross-section and dye and pull.
Good communication skills.
Quick learning ability.#J-18808-Ljbffr