Npi Assembly Intern

OUR STORY
At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today. 
When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world!
Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential. 
YOUR ROLE 
You take part in developing new wire bond process bricks for new package / products / wire bond technology You also help us with engineering activity such as data collection and failure analysis.
Learn about wire bonding process.
Learn about design of experiments (DOE) and engineering validation.
Learn about NPI procedures and SOP
To support NPI Assembly activities and projects  
Learn on how to troubleshoot in systematic approach

YOUR SKILLS & EXPERIENCES
Master OR Bachelor degree in Mechanical Engineering / Material Science / Electrical Engineering / Electronics Engineering or equivalent engineering field.
Good inter-personal skills and able to work well under pressure.
Able to work with multiracial team.

Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future!
To discover more, visit st.com/careers