Responsibilities: Lead quality issue of incoming part and finished product to identify root cause and establish effective corrective and preventive action plan.Coordinate the MRB meeting when there is quality failure, timely disposition and closed loop follow up actions.Manage incoming part and finished product inspection and qualification, develop quality inspection plan and work with process and equipment team on quality improvement activities.Manage incoming inspection team to perform incoming quality inspection effectively, develop incoming inspection quality plan and work China partners and suppliers on quality improvement activities, monitor parts quality at initial stage till mass production.Ensure the Return to Vendor (RTV) process and system is well executed and follow up on Supplier Correction Action Report (SCAR) closure.Lead product and process risk analysis and mitigation development efforts to confirm the design and process team has accurately identified product & process risk, assessed the level of risk and analyze with team to ensure the risks are assessed.To develop an effective measurement metrology improve in process inspection and measurement.Plan and perform process audits internally to ensure compliance per process and system requirements.To chart, monitor and report monthly performance (Finished Product and Supplier).Requirements: Candidate must possess at least a Bachelor's Degree in Engineering or equivalent.At least 3 year(s) of working experience in the related technical field, semiconductor manufacturing is desirable.Preferably trained and have good knowledge in Quality Control 7 Tools, Risk Assessment, PFMEA, Control Plan, SPC, MSA, 8D methodologies, Failure Analysis Reports, 6 Sigma and ISO 9001 standard.Ability to work well independently and work as a part of a team.Verbal and written communication and personal interface skills required.