Staff Engineer Unit Process Engineering Die Attach

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT.
Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals.
Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are.
At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities.
We base our recruiting decisions on the applicant's experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Job Description
In your new role you will:
Sustain and achieve stability index for package under responsibility.
Support production on daily issues investigation and improvement in order to achieve Operation performance.
Sustain and achieve quality stability for DPAK module DA process to achieve zero spill, FAR.
Document updates and refine to ensure no expired documents.
Your Profile
You are best equipped for this task if you have:
Knowledge in die attach process and skills.
ESEC 2007/2009 Soft Solder and Diffusion Soldering.
Basic statistical and SPC knowledge.
Basic problem-solving skills 8D, MRB, DMAIC.
Consumer Electronics Manufacturing More than 10,000 employees.#J-18808-Ljbffr